3D Foldable MCPCB 1.6MM 1OZ 0.24W / mk Nws pib LED teeb
TSIS MUAJ. | Yam khoom | Specification |
PCB Manufacturing Peev xwm | ||
1 | PCB txheej | 1 mus rau 48 txheej |
2 | PCB board khoom hom | CEM-1, FR4, High-TG FR4, ALU, CEM-3, Rogers, HDI, thiab lwm yam. |
3 | Max qhov ntev | 600 x 480 mm |
4 | Min kab dav | 0.1 hli |
5 | Min nrug | 0.1 hli |
6 | Dimension kam rau ua | ± 0.1 hli |
7 | Min qhov taub | 0.2 hli |
8 | PCB board thickness npog | 0.2-6.0 hli |
9 | Min tooj liab thickness hauv qhov | 0.02 hli |
10 | DK tuab | 0.08-6.0 hli |
11 | NPTH loj kam rau ua | ± 0.025 hli |
12 | PTH loj kam rau ua | ± 0.025 hli |
13 | Dimension kam rau ua | ± 0.1 hli |
14 | Qhov chaw kam rau ua | 0.075 hli |
15 | Laser laum qhov loj | 0.1 hli |
16 | Min solder daim npog qhov ncauj | 0.01mm ib |
17 | Yam tsawg kawg nkaus ntawm lub ntsej muag lub ntsej muag sib cais lub nplhaib | 0.05 hli |
18 | Max board twist thiab qhwv | ≤ 1% |
19 | Tiav lub qhov taub | 0.2-6.0 hli |
20 | nplaim taws kuj | 94v 0 |
21 | Impedance tswj kam rau ua | ± 5% |
22 | Txheej txheej tooj liab thickness | 8.75-175 Nws |
23 | Sab hauv txheej tooj liab thickness | 17.5-175 Nws |
24 | Solder mask hom | Xiav, Ntsuab, Dub, Daj, Liab, Dawb |
25 | Nto tiav | ENIG, Kub plating, Immersion nyiaj, Immersion tin, thiab lwm yam. |
26 | Daim ntawv pov thawj | ISO9001, ISO14001, ISO14969 |
Muaj peev xwm thiab Kev Pabcuam Ntau Yam:
PCB Circuit Court layout thiab ntau lawm
Cov kev pab cuam tsim cov yas thiab hlau casing
Khoom customized ntim tsim
SMT / SMD qhov chaw sib dhos thiab DIP los ntawm lub qhov taub (PCBA)
IC programming software (ib-programmed), PCBA functional testing and verification
Ua kom tiav cov khoom sib dhos (xws li yas, hlau casing, PCBA
motherboard, cables, s withes thiab lwm yam khoom, thiab lwm yam)
ROHS ib puag ncig tiv thaiv cov khoom siv
Logistics npaj, importing thiab export cov khoom los ntawm Tuam Tshoj