4 Txheej PCB Manufacturing Prototype Tus nqi pheej yig PCB Chaw tsim tshuaj paus nyob rau hauv Suav teb
Khoom Paub meej
Daim ntawv thov: Electronics, tub rog, tshuaj, thiab lwm yam
Daim ntawv pov thawj: ISO/TS16949/ROHS/TS16949
Solder mask xim: Ntsuab Dub Blue Dawb
Tus lej Txheej: 1-22 Txheej
Kev Pabcuam: Cov kws tshaj lij engineer, zoo tom qab kev pabcuam, tus nqi sib tw
PCB Txuj: IPC-A-610 D / IPC-III Txuj
Qhov kam rau ua: PTH: ± 2mil, NTPH: ± 2mil
Board Thickness kam rau ua: ± 10%
| Kev Pabcuam OEM / ODM: | |||
| Txheej | 1-22 txheej | Min.kab dav | 2mil ua |
| Max.board loj (ib zaug & ob npaugsab) | 700 * 1200 hli | Min.annular nplhaib dav: visa | 3mil ua |
| Nto tiav | HAL (nrog Pb dawb), plated Ni/Au,Immersion silver, IMM Ni/Au, I MM Sn,hard kub, OSP, thiab lwm yam | Min.board thickness (multilayer) | 4 txheej: 0.4mm;6 txheej: 0.6mm;8 txheej: 1mm; 10 txheej: 1.2mm |
| Board cov ntaub ntawv | FR-4;siab TG;siab CTI;halogen dawb;high zaus (rogers, ta-conic,PTFE, Nelson,ISOLA, polyclinic 370 HR);tuab tooj | Plating thickness (Technique:Immersion Ni/Au) | Plating hom: IMM Ni, Min./Max thickness: 100/150U” Plating hom: IMM Au, Min./Max thickness: 2/4U” |
| Tswj impedance | ± 10% | Kev ncua deb ntawmkab rau board ntug | Qhov Loj: 0.2mm V-CUT: 0.4mm |
| Base tooj liab thickness (Innerthiab txheej txheej) | Min.thickness: 1/3 OZ Max.thickness: 6OZ | Min.hole loj (board thickness ≥2mm) | Aspect ratio ≤16 |
| Ua tiav tooj liab thickness | Txheej txheej:Min.thickness 1 OZ,Max.thickness 10 OZ Sab hauv txheej: Min thickness 0.5OZ, Max.thickness 6 OZ | Max.board thickness (ib leeg & ob sab) | 6mm ib |
Sau koj cov lus ntawm no thiab xa tuaj rau peb
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