4 Txheej PCB Raug Tsim Kho Cov Pheej Yig Cov Nqi PCB Chaw tsim tshuaj paus hauv Suav teb
adjustable ipad sawv ntsug, ntsiav tshuaj sawv tuav
Cov Lus Qhia Paub Khoom
Daim Ntawv Thov: Electronics, tub rog, tshuaj, thiab lwm yam
Daim ntawv pov thawj: ISO / TS16949 / ROHS / TS16949
Daim npog ntsej muag xim: Ntsuab Dub Xiav Dawb
Tus naj npawb ntawm txheej: 1-22 txheej
Kev pabcuam: Kws ua haujlwm engineer, zoo tom qab pabcuam, tus nqi sib tw
PCB Txuj: IPC-A-610 D / IPC-III Txuj Ci
Qhov kam rau ua: PTH: ± 2mil, NTPH: ± 2mil
Pawg Thickness kam rau ua: ± 10%
Kev pab OEM / ODM: | |||
Txheej Txheej | 1-22 txheej | Min. txoj kab dav | 2mil |
Max.board qhov loj me (ib leeg & ob npaugtog) | 700 * 1200mm | Min.annular nplhaib dav: vixaj | 3mil |
Deg tas | HAL (nrog Pb pub dawb), plated Ni / Au,Immersion silver, IMM Ni / Au, KUV MM Sn,kub kub, OSP, thiab lwm yam | Min.board thickness (multilayer) | 4 txheej: 0.4 hli;6layers: 0.6 hli;8layers: 1 hli;
10layers: 1.2 hli |
Khoom siv Board | FR-4; siab TG; siab CTI; halogen dawb; high zaus (rogers, tib-conic,PTFE, nelson,ISOLA, polyclinic 370 HR); tooj liab tuab | Tuab lub plating (Txuj ci:Txoj Kev Hloov (Ni / Au) | Hom plating: IMM Ni, Min./Max thickness: 100 / 150U "Plating type: IMM Au, Min./Max thickness: 2 / 4U" |
Impedance tswj | 10% | Ze ntawmtxoj kab rau lub rooj tsavxwm ntug | Qhia Tawm: 0.2mm V-Txiav: 0.4mm |
Luj tooj liab tuab (puabthiab txheej sab nraud) | Min. tuab: 1/3 OZ Max.thickness: 6OZ | Min.hole loj (pawg tuab thickness2mm) | Xam piv≤≤16 |
Tiav tooj liab tuab | Txheej txheej:Min.thickness 1 OZ,Max.thickness 10 OZ
Txheej sab hauv: Min.thickness 0.5OZ, Max.thickness 6 OZ |
Max.board thickness (ib leeg & ob tog sided) | 6 hli |
Sau koj cov lus ntawm no thiab xa rau peb