FR4 Muaj peev xwm:
| Yam khoom | Technical Specifications |
|---|---|
| Hom khoom | FR-1, FR-4, CEM-1, CEM-3, Rogers, ISOLA |
| Khoom Thickness | 0.062 ", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" |
| Txheej suav | 1 mus rau 20 Layers |
| Max.Board Loj | 22.00 x 28.00 Nws. |
| IPC Chav Kawm | Klas II, III |
| Ntiv nplhaib | 5 mil/sab lossis Ntau dua (Min. Design) |
| Ua tiav Plating | Solder (HASL), Lead Free Solder (L/F HASL), ENIG (Electroless Nickel Immersion Gold), OSP, Immersion Silver, Immersion Tin, Immersion Nickel, Hard Kub, thiab lwm yam. |
| Tooj Luj | Sab nraud: Txog 7oz, Sab hauv: mus txog 4oz. |
| Trace/Space Width | 3/3 mil |
| Cov ntaub qhwv me tshaj plaws | 12 miv |
| Plated Slots | 0.016 " |
| Qhov tsawg tshaj plaws | 8 mil;4 mil |
| Cov ntiv tes kub | 1 mus rau 4 Ntug (30 txog 50 Micron Kub) |
| SMD Pitch | 0.080 "- 0.020" - 0.010 hli |
| Soldermask Hom | LPI Glossy, LPI-matte |
| Soldermask Xim | Ntsuab, liab, xiav, dub, dawb, daj, ntshiab |
| Legend Xim | Dawb, Daj, Dub, Liab, Xiav. |
| Yam tsawg kawg nkaus txoj kev dav | 0.031 " |
| Scoring (v-txiav) | Cov kab ncaj nraim, dhia cov qhab nia, CNC V-CUT. |
| Kub | HARD, SOFT, IMMERSION (txog 50 MICRON kub) |
| Cov ntaub ntawv hom ntawv | Gerber RS-274x nrog embedder aperture. |
| Fab.Kev kos duab | Gerber Files, DXF, DWG, PDF |
| Aspect Ratio | 10:01 ib |
| Counter Sink / Counter Bore | Yog lawm |
| Tswj impedence | Yog lawm |
| Blind Vias / Buried Vias | Yog lawm |
| Peelable Mask | Yog lawm |
| Cov pa roj carbon | Yog lawm |
MC PCB peev xwm:
| Yam khoom | Technical Specifications |
|---|---|
| Cov txheej txheem | Ib sab, Ob Sab, Plaub Txheej MCPCB |
| Hom khoom | Aluminium, Copper, Hlau puag MCPCB |
| Laminated khoom | Berquist, Ventec, Polytronics, Boyu, Wazam thiab lwm yam. |
| Ua tiav board thickness | 0.2 ~ 5.0 hli |
| Tooj thickness | Hoz - 3 oz |
| Tus neeg muag khoom ntawm solder mask | Taiyo, Fotochem thiab lwm yam. |
| Xim ntawm daim npog ntsej muag | Dawb, Dub, Liab, Xiav, Daj thiab lwm yam. |
| Nto tiav | L/F HASL, OSP, ENIG, Electrolytic Silver, Immersion Tin, Immersion Silver thiab lwm yam. |
| Hom ntawv tiav | Routing, Punching, V-txiav |
| Hneev thiab twist | ≤ 0.75% |
| Min qhov loj | 1.0 hli |
| Max.board loj | 1500x610mm |
| Min.board loj | 10 mm X 10 mm |