Cov ntsiab lus ceev:
Hom: Rigid PCB
Khoom siv: FR4 TG130
Copper Thickness: 1OZ / 2OZ
Board Thickness: 1 hli
Min.Qhov Loj: 0.01mm
Min.Kab dav: 0.02mm
Min.Kab nrug: 0.01mm
Surface Finishing: HASL
Board Loj: Customized
Ua haujlwm kub: -5 ℃ -60 ℃
Number of Layers: Ob Chav Layers
Cia kub: -20 ℃ -80 ℃
Rated ua hauj lwm voltage: AC100V-250V
Solder mask xim: Dub.Red.Yellow.White.Blue.Green
PCB Txuj: IPC-A-610 E
SMT Efficiency: BGA.QFP.SOP.QFN.PLCC.CHIP
PCB Assembly Test: Visual Inspection (default), AOI, FCT, X-RAY
Substrates Khoom siv: Aluminium, 22F, CEM-1, CEM-3, FR4
Fais fab tuag: 2.0-2.4KV (AC)