Shenzhen sab saum toj zoo txhuas PCB MCPCB nrog Taiyo PSR-4000 series ntshiab dawb solder daim npog qhov ncauj
Manufacturing Peev Xwm:
| yam khoom | Tsim muaj peev xwm |
| Khoom siv | FR4, CEM-1, Aluminium, Poly amide |
| Txheej No. | 1-12 |
| Ua tiav board thickness | 0.1 hli-4.0mm |
| Board Thickness kam rau ua | ± 10% |
| Cooper thickness | 0.5 OZ-3OZ (18um-385um) |
| Copper Plating Qhov | 18-40 : kuv |
| Impedance Tswj | ± 10% |
| Warp & Twist | 0.70% |
| Peev tau | 0.012 "(0.3mm)-0.02" (0.5 hli) |
Duab
| Min Trace Dav (a) | 0.075 hli (3mil) |
| Min Qhov dav dav (b) | 0.1 hli (4 mil) |
| Min Annular Nplhaib | 0.1 hli (4 mil) |
| SMD Pitch (a) | 0.2 hli (8 mil) |
| BGA Pitch (b) | 0.2 hli (8 mil) |
Solder Mask
| Min Solder Mask Dam (a) | 0.0635 hli (2.5mil) |
| Solder Mask Clearance (b) | 0.1 hli (4 mil) |
| Min SMT Pad qhov sib nrug (c) | 0.1 hli (4 mil) |
| Solder Mask Thickness | 0.0007 "(0.018 hli) |
Qhov
| Min qhov loj (CNC) | 0.2 hli (8 mil) |
| Min Punch Qhov Loj | 0.9 hli (35 mil) |
| Qhov Loj TOL (+/-) | PTH: ± 0.075mm; NPTH: ± 0.05mm |
| Qhov chaw TOL | ± 0.075 hli |
Plating
| HASL | 2.5 ua |
| Lead dawb HASL | 2.5 ua |
| Kub Kub | Nickel 3-7um Au: 1-5u'' |
| OSP | 0.2-0.5 hli |
Cov ntsiab lus
| Vaj Huam Sib Luag Qhia TOL (+/-) | CNC: ± 0.125mm, Punching: ± 0.15mm |
| Beveling | 30° 45° |
| Kub ntiv tes kaum | 15 ° 30 ° 45 ° 60 ° |
| Daim ntawv pov thawj | ROHS, ISO9001: 2008, SGS, UL daim ntawv pov thawj |
Peb tuaj yeem ua rau koj:
1-12 txheej FR4 PCB.
1-2 txheej aluminium PCB.
1-4 txheej hloov tau PCB.
CEM-1 PCB
94V PCB ua
SMT thiab DIP los ua ke kev pabcuam.
Sau koj cov lus ntawm no thiab xa tuaj rau peb
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