Direct thermal path MCPCB and Sink-pad MCPCB, Copper Core PCB, Copper PCB Featured Image

Direct thermal path MCPCB thiab Sink-pad MCPCB, tooj liab tub ntxhais PCB, tooj liab PCB

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Product Detail

Khoom Paub meej

Khoom siv hauv paus: Alu / tooj liab

Copper Thickness: 0.5/1/2/3/4 OZ

Board Thickness: 0.6-5mm

Min.Qhov taub: T / 2mm

Min.Kab dav: 0.15mm

Min.Kab nrug: 0.15mm

Surface Finishing: HASL, Immersion kub, Flash kub, plated nyiaj, OSP

Yam khoom: MCPCB LED PCB Luam Circuit Court board, Aluminium PCB, tooj liab tub ntxhais

PCB

V-txiav lub kaum sab xis: 30 °, 45 °, 60 °

Zoo zoo: +/- 0.1mm

Qhov DIA kam rau ua: +/- 0.1mm

Thermal conductivity: 0.8-3 W / MK

E-test voltage: 50-250V

Peel-tawm zog: 2.2N / mm

Warp los yog twist:

PTH Phab ntsa thickness:> 0.025mm

Tsis muaj.	Cov khoom	Index
1	Kev kho saum npoo	HASL, Immersion kub, Flash kub, plated nyiaj, OSP
2	Txheej	Ib sab
3	PCB Thickness	0.6-5 hli
4	Copper Foil Mob Mob	0.5-4 oz
5	Min qhov taub	T / 2 hli
6	Min kab dav	0.15 hli
7	Txheej	1-4 txheej
8	Max board loj	585mm * 1185mm
9	Min board loj	3 hli * 10mm
10	Board thickness	0.4-6.0 hli
11	Qhov chaw min	0.127 hli
12	PTH phab ntsa thickness	> 0.025 hli
13	V-txiav	30/45/60 degree
14	V-txiav loj	5mm * 1200 hli
15	Min.bag pad	0.35 hli

Kev muab: ib sab MCPCB, ob sab MCPCB, ob txheej MCPCB, khoov tau MCPCB, ncaj qha thermal pauv MCPCB, eutectic bonding flip -chip MCPCB.Peb MCPCB yog customized.

1.aluminium puag PCB LED teeb coj teeb module coj

2. Aluminium substrate PCB

3.aluminium puag tooj liab-clad laminate PCB

4. Aluminium puag PCB

1) Khoom siv: FR-4, tooj liab, Aluminium raws

2) txheej: 1-4

3) tooj liab thickness: 0.5oz, 1.0oz, 2oz, 3oz, 4oz

4) Nto tiav: HASL, OSP, Immersion Kub, Immersion nyiaj, Flash kub, Plated nyiaj.

5) solder mask xim: Ntsuab, dub, dawb.

6) V-txiav kaum sab xis: 30, 45,60 degree

7) Kev ntsuas hluav taws xob: 50-250V

8) Daim ntawv pov thawj: UL, ISO9001, ROHS, SGS, CE

MC PCB Technical Capability

;Hom	Yam khoom	Muaj peev xwm	Hom	Yam khoom	Muaj peev xwm
Txheej	/	1-4	Qhov loj	Drilling qhov loj	0.6-6.0 hli
Laminate	Hom laminate	Aluminium, hlau, thiab tooj liab cais puag		Qhov kam rau ua	± 0.05 hli
	Dimension	1000 * 1200mm 60081500mm		Tolerance ntawm qhov chaw	± 0.1 hli
	Board thickness	0.4mm-3.0 hli		Aspect ratio	5:1 ua
	Tolerance ntawm board thickness	± 0.1 hli	Solder daim npog qhov ncauj	Min solder choj	4mil ua
	Dielectric thickness	0.075-0.15 hli	Impedance	Impedance kam rau ua	± 10%
Circuit	Min dav / qhov chaw	5 mil / 5 mil	Peel zog	≥1.8 N / hli
	Tolerance ntawm qhov dav / qhov chaw	± 15%	Deg tsis kam	≥1 * 105M
Tooj thickness	Sab hauv thiab sab nraud	0.5-10.5 hli		≥1 * 106M
			Volume resistrivity
Thermal conductivity		Tsawg tshav kub conductivity 1.0-1.5
		Nruab nrab tshav kub conductivity 1.5-1.8
		High conductivity 2.0-8.0
Solder fioat		260 ℃, 10mil, Tsis muaj hlwv, Tsis muaj kev txiav txim siab
Kev tso cai		≤4.4