36W PCB Nrog Sensor Ceiling Ntxuam Board

Cov ntsiab lus ceev:

Hom: Rigid PCB

Khoom siv: FR4 TG130

Copper Thickness: 1OZ / 2OZ

Board Thickness: 1 hli

Min.Qhov Loj: 0.01mm

Min.Kab dav: 0.02mm

Min.Kab nrug: 0.01mm

Surface Finishing: HASL

Board Loj: Customized

Ua haujlwm kub: -5 ℃ -60 ℃

Number of Layers: Ob Chav Layers

Cia kub: -20 ℃ -80 ℃

Rated ua hauj lwm voltage: AC100V-250V

Solder mask xim: Dub.Red.Yellow.White.Blue.Green

PCB Txuj: IPC-A-610 E

SMT Efficiency: BGA.QFP.SOP.QFN.PLCC.CHIP

PCB Assembly Test: Visual Inspection (default), AOI, FCT, X-RAY

Substrates Khoom siv: Aluminium, 22F, CEM-1, CEM-3, FR4

Fais fab tuag: 2.0-2.4KV (AC)


Product Detail

Cov ntsiab lus ceev:

Hom: Rigid PCB

Khoom siv: FR4 TG140

Copper Thickness: 1OZ / 2OZ

Board Thickness: 1 hli

Min.Qhov Loj: 0.01mm

Min.Kab dav: 0.02mm

Min.Kab nrug: 0.01mm

Surface Finishing: HASL

Board Loj: Customized

Ua haujlwm kub: -5 ℃ -60 ℃

Number of Layers: Ob Chav Layers

Cia kub: -20 ℃ -80 ℃

Rated ua hauj lwm voltage: AC100V-250V

Solder mask xim: Dub.Red.Yellow.White.Blue.Green

PCB Txuj: IPC-A-610 E

SMT Efficiency: BGA.QFP.SOP.QFN.PLCC.CHIP

PCB Assembly Test: Visual Inspection (default), AOI, FCT, X-RAY

Substrates Khoom siv: Aluminium, 22F, CEM-1, CEM-3, FR4

Fais fab tuag: 2.0-2.4KV (AC)

Product Description

Kev koom teshom:

1. Schematic tsim: Circuit Court schematic tuaj yeem tsim raws li cov neeg siv khoom xav tau.

2, PCB tsim: PCB daim duab tuaj yeem tsim raws li cov neeg siv khoom.PCB thiab daim nqi ntawm cov ntaub ntawv tuaj yeem txheeb xyuas raws li cov neeg siv khoom kuaj.

3, Software tsim: SCM software tsim thiab tsim, tuaj yeem sau tau raws li cov neeg siv khoom xav tau, nrog rau qhov xav tau ua haujlwm.Los yog rov sau dua ib feem ntawm software kom haum cov neeg siv khoom kho vajtse tiag tiag.

Hom kev koom tes ntau lawm:

1. Cov ntawv sau, schematic, PCB cov ntaub ntawv thiab daim nqi ntawm cov ntaub ntawv tuaj yeem xa mus rau cov neeg siv khoom rau kev ua haujlwm ntawm cov kev pab cuam thiab Circuit Court boards.

2, Peb tuaj yeem tsim qhov kev pab cuam rau cov neeg siv khoom, pab tsim cov khoom siv hluav taws xob raws li cov neeg siv khoom xav tau.Multi-style kev koom tes kom tau raws li cov neeg siv khoom sib txawv.

3, Kev tsim kho thiab tsim qauv, tus nqi qis.tsuas yog tus nqi thiab cov nqi tsim kho yuav tsum tau, uas tuaj yeem rov qab tau tom qab qee qhov kev txiav txim.tuaj yeem tsim thiab tsim raws li tus neeg siv khoom xav tau.

 

PCB kev ua haujlwm muaj peev xwm:

1

Txheej Ib sab, 2 mus rau 18 Txheej
2 Board khoom hom FR4, CEM-1, CEM-3, ceramic substrate board,aluminium raws board, High-TG, Rogers thiab lwm yam
3 Compound khoom lamination 4 rau 6 txheej
4 Qhov siab tshaj plaws 610 x 1,100 mm
5 Dimension kam rau ua ± 0.13 hli
6 Board thickness npog 0.2-6.00 hli
7 Board thickness kam rau ua ± 10%
8 DK tuab 0.076 txog 6.00mm
9 Yam tsawg kawg kab dav 0.10 hli
10 Yam tsawg kawg ntawm kab 0.10 hli
11 Txheej txheej tooj liab thickness 8.75-175 µm
12 Sab hauv txheej tooj liab thickness 17.5-175 µm
13 Drilling qhov taub (mechanical laum) 0.25-6.00 hli
14 Tiav qhov taub (mechanical laum) 0.20-6.00 hli
15 Qhov txoj kab uas hla tolerance (mechanical laum) 0.05 hli
16 Qhov txoj hauj lwm kam rau ua (mechanical laum) 0.075 hli
17 Laser laum qhov loj 0.10 hli
18 Board thickness thiab qhov sib piv 10:1
19 Solder mask hom Ntsuab, Daj, Dub, Ntshav, Xiav, Dawb thiab Liab
20 Yam tsawg kawg nkaus solder mask Ø 0.10 hli
21 Yam tsawg kawg nkaus ntawm lub ntsej muag lub ntsej muag sib cais lub nplhaib 0.05 hli
22 Solder daim npog qhov ncauj roj ntsaws qhov taub 0.25-0.60 hli
23 Impedance tswj kam rau ua ± 10%
24 Nto tiav Kub cua theem, ENIG, immersion nyiaj, kub plating, immersion tin thiab kub ntiv tes

33


  • Yav dhau los:
  • Tom ntej:

  • Sau koj cov lus ntawm no thiab xa tuaj rau peb