Kub Muag HDI Multilayer FR4 PCB Circuit Boards Rau Micro SD Card
Cov ntsiab lus ceev:
Copper Thickness: 1 oz
Board Thickness: 1.0 hli
Min.Qhov Loj: 0.20mm
Min.Kab Dav: 0.075mm
Min.Kab nrug: 0.075mm
Surface Finishing: ENIG
Board Loj: Customized
Solder mask Xim: Ntsuab Ink
Board Thickness kam rau ua: +/- 10%
V-txiav kaum sab xis: 25 °, 30 °, 45 °, 60 °
Twist & qhwv: ≤ 0.5%
File:Pro tel 99se/P-CAD/Auto cad/Cam350
Inner packing: Nqus packing, hnab yas
Outer packing: Standard carton packing
Kev pabcuam: PCB & PCBA
Txheej: 6 txheej
Silk Mask: Dawb
Khoom Description
| 1 | Kev piav qhia | Specification ntawm PCB |
| 2 | Khoom siv | FR-4 / HTG150-180 FR-4 / CEM-1 / CEM-3 / Aluminium |
| 3 | Txheej | 1-20 |
| 4 | Board Thickness | 0.2mm-4.0 hli |
| 5 | Board Thickness kam rau ua | +/- 10% |
| 6 | Tooj thickness | 17.5um-175um (0.5oz-5oz) |
| 7 | Min Trace Dav | 0.15 hli |
| 8 | Min Qhov dav dav | 0.15 hli |
| 9 | Min Drilling Dia | 0.2 hli |
| 10 | PTH tooj liab thickness | 0.4-2mil (10-50um) |
| 11 | Tolerance ntawm Etching | ± 1mil (± 25um) |
| 12 | V-txiav kaum sab xis | 25 °, 30 °, 45 °, 60 ° |
| 13 | Pearl Strength ntawm kab | ≥6lb/in(≥107g/mm) |
| 14 | Impedance tswj thiab kam rau ua | 50Ω ± 10% |
| 15 | Twist & qhwv | ≤ 0.5% |
| 16 | Solder daim npog qhov ncauj | Ntsuab, Liab, Xiav, Dawb, Dub, Daj |
| 17 | Nto tiav / Plating | HASL / Lead Dawb HASL / OSP / Kub Plating / Immersion Kub / ENIG |
| 18 | Daim ntawv pov thawj | ROSH.ISO9001 |
| 19 | Cov ntaub ntawv | Protel 99se/P-CAD/Auto cad/Cam350 |
| 20 | Ntim sab hauv | Nqus packing, hnab yas |
| 21 | Kev ntim khoom sab nrauv | Standard carton packing |
Peb lub Hoobkas:
Sau koj cov lus ntawm no thiab xa tuaj rau peb
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