Low-cost Aluminum core laminated copper foil SinkPAD PCB Featured Image

Tus nqi qis Aluminium core laminated tooj liab ntawv ci SinkPAD PCB

Dab tsi yog Thermoelectric Separation Substrate?

Cov khaubncaws sab nraud povtseg thiab cov thermal ncoo ntawm lub substrate yog sib cais, thiab lub hauv paus thermal ntawm thermal Cheebtsam ncaj qha mus cuag lub tshav kub-ua nruab nrab kom ua tau zoo thermal conductive (zero thermal resistance) nyhuv.Cov khoom ntawm lub substrate feem ntau yog hlau (Copper) substrate.

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Product Detail

Cov ntaub ntawv PCB

PCB Hom	SinkPAD II Technology
PCB Loj	50.0 × 60.0 hli
Cov duab	Vajvoog Boards
Base Hlau Hom	Aluminium
Ua tiav Thickness	0.062 nti (1.57 hli)
Direct Thermal Path	YOG
Thermal conductivity	240.0 W/mK
Nto tiav	LF HASL
iav Hloov Temp.	Kub ntawm 170 degrees Celsius
UL Pom zoo	Yog lawm
RoHS Ua Raws Cai	Yog lawm